IME presented a total of 17 papers at the 56th Electronics
Components and Technology Conference (ECTC) held in San
Diego from 30 May - 2 June. The topics included 3D interconnects,
drop impact, wafer level packaging, MEMS packaging and
bio-fluidic package, reflecting IME's wide scope of research
in packaging technologies. |
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ECTC is the premier international packaging,
components and microelectronic systems technology conference.
This year's conference consisted of 38 technical sessions,
16 professional development courses and a technology corner
with over 70 exhibitors.
Papers by IME researchers have also been accepted at upcoming
conferences such as:
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Radio Frequency Integrated
Circuit Conference 2006, 11 - 13 June 2006, San Francisco,
USA (7 papers accepted) |
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20th Eurosensors, 17 - 20 September
2006, Goteborg, Sweden (6 papers accepted) |
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36th European Solid-State Device Research
Conference (ESSDERC 2006), 18 - 22 September 2006, Montreux,
Switzerland (6 papers accepted) |
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32rd European Solid-State Circuits
Conference (ESSCIRC), 18 - 22 September 2006, Montreux,
Switzerland (2 papers accepted) |
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10th International Conference on Miniaturized
Systems for Chemistry and Life Sciences (µTAS2006),
5 - 9 November 2006, Tokyo, Japan (8 papers accepted) |
In addition, IME’s works were recently recognized
in prestigious journals such as IEEE Electron Device Letters,
Applied Physics Letters, Sensors and Actuators, and Lab on
a Chip.
Check out the list of recent publications published and accepted
here.
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