Singapore, 30 June 2009 - The Institute of Microelectronics (IME) today announced the launch of the 10th Electronic Packaging Research Consortium (EPRC 10) to address key integration challenges of 3-dimensional (3-D) Packaging and Embedded Module technologies during a signing ceremony. IME is spearheading the consortium with 16 company members that include Asahi Glass Co Ltd, ASM Technology Singapore Pte Ltd, Chartered Semiconductor Manufacturing Ltd, Compass Technology Company Ltd, Disco Hi-Tec Singapore Pte Ltd, EVG Group, Ibiden Singapore Pte Ltd, Infineon Technologies Asia Pacific Pte Ltd, Kinergy Ltd, Nepes Pte Ltd, NXP Semiconductors Singapore Pte Ltd, Shanghai Sinyang Semiconductor Materials Co Ltd, Silecs Oy, Sumitomo Bakelite Singapore Pte Ltd and Tango Systems Inc in 2 projects.

IME Launches EPRC 10 Consortium
The Electronic Packaging Research Consortium (EPRC) is a resource and cost sharing platform for electronics packaging research and development in pre-competitive areas of common industry technology needs. Its goal is to inject leading upstream core capability (mainly design and process guidelines) into consortium members so they can apply these enabling technologies to their products and processes. The consortium consists of members from electronics companies, and the IC packaging supply chain such as wafer fabs, packaging and testing house, equipment and material suppliers. Since 1996, the EPRC platform has injected invaluable R&D capabilities into the operation of many multi-national and local enterprises in the electronics packaging industry over nine consortia. It has successfully achieved new technological breakthroughs in novel chip size packages for wireless applications, laminate packages for high pin count high performance ICs, and optical packages for communication devices.
Membership is still open to Semiconductors, Photonics, MEMS, Electronics System & Modules related companies. To explore collaboration with IME in the consortium, please contact:
Mr Tan Teck Chun
Manager Industry Development
Email: teckchun@ime.a-star.edu.sg
Tel: +65 67705409
For information on membership, please visit here
For more information, please click here for the press release |