INTERCONNECTION AND ADVANCED PACKAGING PROGRAM - TECHNOLOGY DEVELOPMENT

Scientist - TSV Integration

This position deals with 3DIC/Interposer with TSV technology research and development.

Responsibilities

• Establish the new Through Silicon Via (TSV) or 3D interconnection technology platform, such as 3DIC, TSV interposer.
• Develop the key TSV and backend module and integration processes
• Perform TSV technology device characterization and reliability assessment to set up the design rule
• Work with equipment and material suppliers to interface the supply chains for technology development

Requirements:

• PhD / Master's degree in Mechanical engineering or Material science with five years' research experience
• Experience in semiconductor Through Silicon Via (TSV), BEOL, bonding, assembly module process or integration, Experience in polymer related material is a plus.
• Knowledge in thermo-mechanical modeling and stress analysis
• Knowledge and hands-on experience of TSV and advanced package processes
• Experience in project scoping and execution
• Self-motivated and proactive team player with ability to work in a multidisciplinary team
• Excellent analytical and problem solving skills

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