MEMS PROCESS TECHNOLOGY

Scientist - Wafer Level Packaging for MEMS devices

The key responsibilities will include

• Development of wafer level hermetic/vacuum encapsulation technology for MEMS devices.
• Design and run experiments for packaging process module development and process integration
• Characterization of MEMS packaging, reliability testing and failure analysis
• Documentation of packaging results and provide design rules for wafer level MEMS packaging
• Training of MEMS consortium members on MEMS packaging
• Interface with assignees for process integration activities

Requirements:

• PhD degree in Mechanical, Electrical or Material Engineering with 4-5 years of industry experience
• Hands-on experience on wafer level MEMS packaging related works, including microfabrication process, wafer bonding with different material etc.
• Knowledge in MEMS design, electrical and mechanical modeling
• Excellent communication skills and teamwork with strong self-motivation

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