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Medical Diagnostics: Quick Blood Testing
IME researchers have developed an integrated chip for determining protein biomarkers in blood. The chip can detect three cardiac biomarkers from a fingerprick of blood in 45 mins and it is one order of magnitude higher in sensitivity than conventional enzyme linked immunosorbent assay (ELISA) method. The chip may be harnessed for point-of-care devices for rapid and sensitive diagnosis in heart patients.
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Si Optical Modulator: Low Loss, High Speed, CMOS-Compatible
IME researchers have developed a silicon optical modulator for long haul communications. By counter doping the regions outside of the active modulation region, both switching speed and modulation efficiency are minimally affected. The new silicon modulator has demonstrated a loss.efficiency figure of merit (FOM) of 19.4 dB.V, which is competitive with that of Lithium Niobate modulators (20 dB.V) that currently dominate this market segment. The new silicon modulator offers significant cost advantages as it is CMOS-compatible and allows high monolithic integration capability.
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Better Pressure Sensing in a Different Mode
IME researchers have described a pressure sensor that exploits nanowire field-effect transistor principles in the subthreshold mode. Compared to its inversion operation mode, the device exhibited 1000x enhancement in signal-to-noise ratio (S/N) and 4x increased pressure sensitivity in subthreshold mode, suitable for miniature low power pressure sensors.
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FUSI: Gateway to Integration
IME researchers have designed and developed an integration scheme with a Ni fully silicided (FUSI) gate on a vertical nanowire-based metal-oxide-semiconductor field-effect transistors (MOSFET). The scheme enables nanowire devices to be incorporated into circuits as the threshold voltage (VT) can now be tuned independently. The scheme also favours further scaling down and could be applied to produce multiple VT devices in logic circuits under the same doping conditions.
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Applied Materials and Singapore’s Institute of Microelectronics to Set Up Advanced Packaging Center
Joint facility will develop new tools and integration schemes for growing wafer-level packaging market...more
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IME Takes Gold and Bronze Prize at Inaugural Chip Design Competition at ISIC 2011
Singapore, 15 December 2011 - IME’s research teams have been awarded the gold and bronze prize at the inaugural Chip Design Competition, held in conjunction with the biennial International Symposium of Integrated Circuits (ISIC) 2011, one of the world’s major conferences in the area of integrated circuits engineering... more
A*STAR Institute of Microelectronics Silicon MEMS Technology Developed For LinkStar Microtronics Qualified By Customers For Volume Production
Singapore, 14 December 2011 - The pilot shipment of silicon optic device fabricated using novel MEMS technology developed by A*STAR Institute of Microelectronics (IME) for LinkStar Microtronics Pte. Ltd. (LinkStar), a one year old company which is a spin-off from IME, has been qualified by LinkStar’s customers for mass production. Using the silicon MEMS technology, LinkStar is able to deliver novel silicon optical devices with high accuracy and repeatability at a competitive cost... more
A*STAR Institute of Microelectronics and TEZZARON Team Up To Develop 2.5D/3D Through-Silicon Interposer Technology
Singapore, 6 December 2011 - A*STAR Institute of Microelectronics (IME) and Tezzaron Semiconductor, a leader in 3D-ICs, have today announced a research collaboration agreement to develop and exploit advanced Through Silicon Interposer (TSI) technology. The two organizations will improve and refine the design and manufacture of silicon interposers and work to standardize the process, flows, and process design kits (PDKs). Initial early production devices are already in development, based on IME’s TSI technology and incorporating 3D-ICs from Tezzaron. Fabrication will be completed in IME’s state-of-the-art 300mm R&D Fab... more
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Seeking a Challenging and Rewarding Career in the area of Microelectronics Research? Exciting career opportunities await you at IME...
• Senior Managers
/ Managers
- Deputy Director / Senior Manager / Manager - Industry Development (Commercialization)
- Industry Development Manager
/ Senior Manager - Interconnection & Advanced Packaging Program
- Industry Development Manager – Miniaturized Medical Devices
• Scientists
- Scientist - Biophotonics (Immunosensor)
- Biosensor
- Emerging
NVM
- Linear/Non-Linear Power Amplifier IC Design
- MEMS
Design
- Silicon Photonics, Active Devices
- TSV
Integration
- Wafer Level Packaging for MEMS devices
- View Other Vacancies
Beside the above mentioned vacancies, we are constantly seeking talented PhD candidates who have a passion for research in the areas of Nano-Electronics, Nano-Photonics, Nano-MEMS, Bio-Electronics, Bio Photonics, Medical Devices, Advanced Packaging, Ultra Low Power, Wireless and High Band Width. Pertinent industry experiences will be an added advantage.
If you feel that you have what it takes
to be part of the research scene, we invite you to email
us your detailed resume, including expected and current salaries,
publications and patents lists.
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December 2011 - IME Takes Gold and Bronze Prize at Inaugural Chip Design Competition at ISIC 2011
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November 2011 - IME Congratulates Winners of Young Researcher Collaborative Grant Award
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November 2011 - IME Team Receives IES Prestigious Engineer Achievement Award 2011 for High Performance Si Photonics and Plasmonics
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October 2011 - A*STAR Institute of Microelectronics Receives ISO 13485 (Medical Devices Standard) Certification
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October 2011 - IME Attachment Student Wins Bronze Medal At The 5th TSMC Outstanding Student Research Award
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September 2011 - IME Named Finalist for World Technology Award for Second Year Running
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June 2011 - IME Publication in IEEE Transactions on Components and Packaging Technologies Wins Best Paper Award
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More Accolades and Achievements
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